CN

13823605006

Product Centre

Click here

200×200 mm UV adhesive remover

Click here

350 × 350 mm semiconductor UV de-resin machine

Click here

8-inch manual wafer laminating machine, 6-inch laminating machine, 12-inch semiconductor wafer laminating machine, wafer thinning and dicing

Click here

UV Debonding Machine for Semiconductor Chips; 5-inch UV Debonding Machine with Cold-Light LED

Click here

Wafer UV Desmelting Machine 02

Click here

UV Debonding Machine for Wafers

Click here

Wafer UV Stripping Machine 03

Click here

Wafer UV Stripper 04

Click here

Wafer UV Stripping Machine 05

Click here

Wafer UV Stripping Machine 06

Click here

Wafer UV Stripper 07

Click here

Standard 6-inch and 8-inch UV Tape De-adhesion Machines

Homepage

About Us

Company Profile

Accreditations and Awards

Product Centre

Wafer Coating Machine

Wafer Coating Machine

UV De-gelling Machine

Wafer Stripping Machine

Frame Box CASSETTE

More+

News and Information

Company News

Industry News

Technical Basics

Case Studies

Online Enquiries

TikTok

WeChat

Shenzhen Headquarters: Deshengxing Electronics
Dongguan Office: Room 401, Building 2, Shenjian Industrial Park, No. 183 Zhangluo Yongning Road, Zhangmutou Town, Dongguan (press 5 on the lift)
邮箱：394413500@qq.com
Tel: 13823605006

Copyright © Shenzhen Deshengxing Electronics Co., Ltd. Guangdong ICP Registration No. 16127298-1 Technical support: Honhoo Tech