Standard 6-inch and 8-inch UV Tape De-adhesion Machines

UV Adhesive Remover, UV Tape Adhesive Remover, 6-inch, 8-inch and 12-inch Semiconductor UV Adhesive Removers, UV Film Adhesive Removal

Shenzhen Deshengxing Electronics Co., Ltd. supplies UV adhesive removers from stock

What is a UV de-gelling machine?
In the semiconductor chip manufacturing process, prior to die cutting, the wafer is secured to a frame using a die-cutting adhesive film; once the die-cutting process is complete, the adhesive film is exposed to UV light to cure and harden it,

This is to reduce the tackiness of the wafer-fixing film, thereby ensuring the smooth progress of subsequent packaging processes. In other words, UV tape possesses high adhesive strength, ensuring that the tape adheres firmly to the wafer during the wafer polishing or dicing processes.

When exposed to ultraviolet light, the adhesive strength decreases. Consequently, wafers or chips can easily peel away from the adhesive tape following UV exposure. The UV de-bonding machine addresses the de-bonding process in the cutting of wafers, glass and ceramics,

The range of industries for which this product is suitable is not currently limited to the semiconductor packaging sector; it is also applicable to the removal of UV-cured adhesive coatings from semiconductor materials used in optical lenses, LEDs, ICs, semiconductors, printed circuit boards and portable hard drives.

UV de-resiners in the prior art predominantly utilise UV mercury lamps; however, as mercury lamp light sources generate a high level of heat, they are prone to damaging heat-sensitive materials. Furthermore, they are inefficient and make it difficult to accurately control quality standards, rendering them unsuitable for the irradiation of high-precision components such as chips.

Shenzhen Deshengxing Electronics Co., Ltd. utilises an environmentally friendly, low-temperature LED UV light source de-bonding machine, which effortlessly completes the UV film de-bonding process without damaging the wafers, thereby fully meeting production requirements.

Application: Suitable for removing UV coatings from semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, printed circuit boards and portable hard drives, as well as from glass filters, and for removing UV adhesive tape.

A UV de-bonding machine is a fully automated piece of equipment designed to reduce and remove the adhesive properties of UV film and cutting film tape. For workpieces such as wafers and glass, UV tape is applied to 8-inch, 12-inch and 15-inch mounting fixtures using a de-bonding device,

It has a highly effective de-gelling capability, enabling it to rapidly reduce the tackiness of UV TAPE when applied to workpieces.

Features of the UV de-gelling machine:
1) Compact in size, suitable for full-chip illumination of 6-, 8-, 10- and 12-inch chips
2) Adjustable time and brightness; touchscreen operation; simple and convenient
3) Illumination from below, making it easier to position the wafer
4) LED cold light source: an environmentally friendly product characterised by low temperature, uniform exposure, a compact design and low energy consumption; it is the ideal model for the semiconductor industry, and the low temperature causes no damage to heat-sensitive materials
5) It has a service life more than 10 times longer than that of a standard mercury lamp, with a continuous service life of 15,000–30,000 hours.
6) Zero maintenance costs; no need to replace the light source components during long-term operation
7) Enclosed light source design, with no UV leakage, and harmless to humans