Wafer UV Stripping Machine 06

Product information:

Quality Assurance / Extended Warranty / Peace of Mind

Performance of the UV de-gelling machine:

The curing time for adhesives is generally 30–40 seconds; however, depending on the adhesive properties and suitability of the adhesive film, as well as the wavelength of the lamp, the curing time may be longer or shorter,

However, this system is highly versatile; for example, it can be used in research and development as well as on a wide variety of production lines.

Features of the UV de-gelling machine:

1. Compact desktop design

2. The gel separation process is carried out fully automatically at the touch of a button via an LCD touchscreen

3. LED cold light sources have replaced traditional high-pressure mercury lamps; the results have been certified by Dongguan Judeweiye Electronic Technology Co., Ltd.

4. Their service life is more than 10 times longer than that of standard mercury lamps

5. Compared with light sources comprising mercury lamps, LED cold light sources provide more stable and uniform illumination.

6. LED cold light sources are highly safe, generate little heat and have low power consumption

7. When the equipment door is opened or closed, the LED cold light source is switched off, effectively preventing UV light from escaping and causing harm to humans.

8. The UV curing machine is equipped with a fault indicator light

9. Wafer sizes: available in 6-inch, 8-inch and 12-inch

10. The operator simply needs to place or remove the workpiece; all other tasks are fully automated.

11. This compact, desktop model features an imported cold light source that emits uniform light in the 350–400 nm wavelength range, thereby removing the adhesive from the film.

12. Featuring low operating temperatures, uniform exposure, a compact design and low energy consumption, this model is ideal for the semiconductor industry.