Die Attachment in the UV LED Packaging Process
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Framework of the Production Process for a Die Attachment Station
The production process for a UV LED die-attach station can be divided into three main stages: preparation of raw materials (die-attach adhesive, carriers, wafers), die-attach and curing.
More specifically, the production process at a die-attach station can generally be further subdivided as follows:Equipment preparation, material preparation, wafer expansion process, dispensing process, die attachment process, baking processetc.
1. Equipment Preparation Equipment Preparation:Wafer Enlarger, die attach machines,Oven and other advanced intelligent automation equipment.
2. Preparation of materials
3. Crystal growth process; this process utilises Wafer Coating Machine
4. Dispensing process
5. Die-attach process
6. Baking process
