UV film

UV film (UV tape) is specifically designed for wafer polishing, cutting and the handling of flexible electronic components. Coated with a special adhesive, it offers high adhesion; during cutting, its exceptional adhesive strength securely holds the wafer in place, ensuring that even small wafers do not shift or peel away. This prevents wafers from falling off or scattering during the grinding and cutting processes, enabling precise cutting. Once processing is complete, exposing the tape to an appropriate amount of ultraviolet light instantly reduces its adhesive strength. Even large wafers can then be picked up easily and accurately without leaving adhesive residue, causing delamination or contamination. This improves pick-up efficiency during wafer handling, eliminates contamination caused by adhesive residue, and ensures that the ICs are not adversely affected by exposure to ultraviolet light.

Product features:

1. High adhesion during cutting; after UV curing, the adhesion is very low, so the wafers do not scatter when picked up and no adhesive residue remains.
2. The UV curing time is short, effectively improving work efficiency.

       3. Made from PET substrate, it offers stable, high adhesion; following exposure to a UV curing machine, the adhesion can be reduced to facilitate die removal.

       4. A PET release film is used, which is suitable for lamination in a cleanroom.

       5. Suitable for cutting wafers, glass and ceramic plates.

Uses of UV film

1. Semiconductor silicon wafers — blue film for cutting, UV film for cutting, protective film with release liner

2. Semiconductor silicon wafers — thinning, back-grinding

3. Semiconductor silicon wafers — film that can be torn by hand after thinning

4. Semiconductor silicon wafers — Flip-chip film

5. Semiconductor silicon wafers — thermal release film, UV film

6. Blue protective tape is used as surface protection tape during the back-side polishing process of silicon wafers in IC/semiconductor manufacturing.

A protective film for the circuit surface during the back-grinding of semiconductor silicon wafers (IC/semiconductor process). An adhesive film used during the grinding of semiconductor silicon wafers.
Points to Note
(1) Before applying the tape, please wipe the surface of the substrate to remove any grease, dust, moisture, etc.
(2) The adhesive strength of the tape will decrease rapidly when exposed to sunlight; therefore, when storing the tape, it must be placed in a light-proof bag and kept in a cool, shaded place.
(3) When using the adhesive tape, please ensure that the ambient temperature is between 10℃ and 30℃. Use outside this temperature range may result in poor adhesion.
(4) When using the tape, please do not touch the adhesive side directly with your hands.
(5) If the sticker has been placed in the wrong position, please use a brand-new piece of tape; do not reuse the tape. Please feel free to contact us for further enquiries.

Dongguan Jude Weiye Electronic Technology Co., Ltd. is a manufacturer specialising in the research, development and production of equipment used in the packaging and testing processes of the semiconductor industry, including debonding machines, wafer laminating machines, wafer film expansion machines and other related equipment. The company’s products are widely used in the electronics, plastics, hardware, household appliances, automotive and printing industries, amongst others. Thanks to its vigorous development, the company has become a leading supplier of high-quality auxiliary materials to sectors such as mobile phones, computers and other digital products, LED lighting, LED backlights, FFCs and electronic appliances.