12-inch semi-automatic wafer laminating machine; semiconductor wafer thinning and laminating machine; chip wafer laminating equipment

The semi-automatic film application machine series comprises fast and efficient machines specifically designed for the cutting or grinding processes of wafers, glass, LEDs, PCBs and ceramics. The machine’s unique film-saving design significantly reduces film application costs. Furthermore, it is equipped with air-cushioned pressure rollers (with adjustable tension) and a flexible platen design, which not only accommodates a variety of products but also minimises application stress, ensuring the products remain undamaged. It is easy to use and can be operated immediately without the need for training.