Manual film removal and demoulding of silicon wafers

This film-stripping machine is used to remove the protective tape from the surface of wafers following thinning or etching processes.

Product features:
1. The work tray features heating and vacuum functions, as well as an imported temperature control system, ensuring stable performance and convenient, quick operation.
2. The equipment can be used for film stripping on 4”, 5”, 6”, 8” and 12” wafers.
3. The work tray, which has undergone an anti-static Teflon treatment, effectively protects the chips on the wafers