Manual wafer coating machine

Instructions:

◆ Plug in the power supply and connect the quick-release coupling to the high-pressure air hose;

◆ Switch on the power and set the temperature to 60 °C (film temperature may vary by ±5 °C depending on the wafer);

◆Set the upper cylinder switch to the “Up” position; the upper die will return to its uppermost position. Set the lower cylinder switch to the ‘Down’ position; the lower die will return to its lowest position (repeat the lower cylinder movement several times to adjust the upward speed to a suitable level).

◆ Release the latch, lift the upper workpiece plate, place the inner ring of the wafer expansion ring onto the lower die, then position the wafer-mounted flip-chip carrier in the centre of the lower workpiece with the wafer facing upwards. Close the upper workpiece plate and secure the latch.

◆Set the lower cylinder switch to the “Up” position; the lower die will rise slowly, causing the film to begin spreading outwards, and the spacing between the grains will gradually increase. Once the spacing between the grains has expanded to 2–3 times its original size, stop the upward movement and place the outer ring of the grain-spreading ring flat on the film, with its rounded edge facing downwards, directly above the inner ring.

◆Set the upper cylinder switch to the “Down” position; the upper die will lower. Fit the expanded crystal-turning film securely into place, then return the upper die to its uppermost position.

◆Set the lower cylinder switch to the “Down” position; lower the lower die to its lowest position, remove the die-flipping film from which the die has been expanded, trim off any excess film, and send it to the next stage for bonding and die attachment.

Points to note:

◆ Never bring your hands close to or place them on the pressing surfaces whilst the cylinder is in operation;

◆ Do not strike or rub the surface of the lower die with sharp objects, as this may cause scratches;

◆When installing the machine, ensure it is correctly and securely earthed;

◆ There is a risk of electric shock inside the cabinet; the door must be securely locked;

◆ When replacing heating elements or other electrical components, this must only be carried out with the power plug disconnected;

◆ Never wipe the machine with a cloth dampened with water or solvents, as this may result in an electric shock or fire hazard.

Maintenance:

◆ Wipe off any dust with a clean cloth, and regularly apply a small amount of machine oil to moving parts to lubricate them;

◆ The surface on which the wafer flipping film is placed must be clean; any grease or dust on it will contaminate the wafer, resulting in defective products.

Information for Buyers

I. Colour Differences

All product images are photographs of the actual items. As colour may vary slightly due to differences in computer monitor display, please refer to the actual item you receive.

II. After-sales service

Returns will not be accepted for reasons relating to the customisation of the product rather than its quality. Should you have any queries upon receipt of your order, please do not hesitate to contact us; we are here to assist you wholeheartedly.

III. Regarding Prices

All prices quoted for our products are for reference only; please discuss pricing with our sales representatives, as we offer preferential rates for bulk orders. (Generous discounts available)

IV. Regarding Dispatch

We will dispatch your order promptly once payment has been received, and we will endeavour to use the courier service specified by the customer wherever possible. Our dedicated staff carry out rigorous quality checks on all items prior to dispatch, so please feel free to shop with confidence.