Semiconductor Coating and Laminating Machine

 

Product Information
Quality Assurance / Extended Warranty / Peace of Mind
Projects	DSXUV-WM6		DSXUV-WM8	DSXUV-WM12	Unit	Notes
Suitable wafer sizes	3-6		3-8	3-12	lnch	Glass, ceramics, wafers LED PCBs and similar items can be made to size Custom designs available upon request Work tray
Minimum wafer thickness applicable	150 µm; micro-perforated tray: 100 µm				um	Can be customised to be thinner
Suitable frame sizes	6		6/8	6/8/12	lnch
Heating temperature range of the worktable	Room temperature to 65		Room temperature to 65	Room temperature*65	℃
Component replacement intervals	<10		<10	<10	minutes
Machine dimensions	850(D) 390 (W) × 400 (H)		900(D) *450 (W) * 400 (H)	1000(D) *550 (W) * 400 (H)*	πn	Subject to actual dispatch
Power supply	AC220		AC220	AC220	V
Compressed air	0.5~0.8		0.5″0.8	0.5″0.8	MPa	50–60 Hz

 

Product description:

The manual film-application machine series comprises high-speed film-application machines specifically designed for the cutting processes of wafers, glass, LEDs, PCBs and ceramics. The machine’s unique film-saving design significantly reduces film application costs. Furthermore, it is equipped with air-cushioned pressure rollers (with adjustable tension) and a flexible platen design, which not only accommodates products of varying thicknesses but also minimises application stress to the greatest extent possible, ensuring the products remain undamaged. It is easy to use and can be operated immediately without the need for training.

Key features:

◆Suitable for blue films, UV films, PET substrate films and double-layer films.

◆An optional micro-perforated film-application tray suitable for ultra-thin wafers.

◆ The heated, elastic film-laying platen is designed to adapt to wafers of varying thicknesses.

◆ A unique design featuring adjustable pressure on the film-application rollers.

◆Fitted with a circumferential cutter and a cross-cut blade.

◆ Optional ionised air bar for static elimination.

◆ Compact in size, designed for desktop use.

The DSXUV-WM6 manual film coating machine is suitable for wafers up to 6″ in size.

The DSXUV-WM8 is suitable for wafers up to 8″ in diameter; the DSXUV-WM12 is suitable for wafers up to 12″ in diameter.

Hui Sheng Film Manual Film Application Machine:

The specially designed film-saving mechanism makes this series of manual film applicators highly economical, saving approximately 15% compared to standard manual film applicators, thereby significantly reducing customers’ film application costs; these cost savings will be even more pronounced when using expensive UV films, both now and in the future.

Micro-perforated film-application tray for ultra-thin wafers (optional):

The film-application stage, featuring a micro-perforated design, combined with a unique air-flow system and a resilient support structure, is suitable for wafers, glass or ceramics as thin as 100 µm; This structure, combined with a roller assembly featuring flexible, air-cushioned support and adjustable tension, minimises damage to ultra-thin wafers during film application, thereby significantly reducing the likelihood of breakage.

Heated, stretch-resistant tray with a Teflon-coated surface:

The heated platen, with its adjustable temperature range, ensures that the film adhesion can be optimised to the ideal condition. The spring-loaded platen adapts automatically to wafers, glass or ceramics of varying thicknesses.

The anti-static Teflon coating on the surface not only minimises the static electricity generated during film application but also prevents physical scratches to the chip. This machine is equipped with an automatic film-retrieval system, making it suitable for use with double-layer films that include a protective layer.