You are welcome to come and test the system or arrange for it to be taken out of service. Please contact: Mr Liu on 18928278160
I. The result is shown in the figure
Before and after the die expansion process on silicon wafers, the uniformity and quality of the cutting lines are assessed to facilitate subsequent operations.
Before wafer expansion
After wafer expansion
II. Why use a crystal-expanding machine?
As the cutting grooves between the wafers are only so wide, when sorting a particular wafer, there is a risk of it coming into contact with the surrounding wafers. Therefore, by using a wafer expansion machine to expand the film, the subsequent processing stages can pick up the wafers more effectively, thereby preventing them from colliding with one another and protecting them.
Damaged products under a microscope
After using the wafer-expansion machine,
Increasing the spacing between particles prevents collisions from all sides and protects the grains.
III. Adaptation to Subsequent Processes
Die bonding machines, sorters, etc.
