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晶圆裂片机半自动半导体芯片裂片设备 GPP晶圆激光切割压力可调 - Image 2

晶圆裂片机半自动半导体芯片裂片设备 GPP晶圆激光切割压力可调 - Image 3

晶圆裂片机半自动半导体芯片裂片设备 GPP晶圆激光切割压力可调 - Image 4

晶圆裂片机半自动半导体芯片裂片设备 GPP晶圆激光切割压力可调 - Image 5

Wafer Dicing Machine; Semi-automatic semiconductor chip dicing equipment; GPP wafer laser cutting; Adjustable pressure

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Shenzhen Headquarters: Deshengxing Electronics
Dongguan Office: Room 401, Building 2, Shenjian Industrial Park, No. 183 Zhangluo Yongning Road, Zhangmutou Town, Dongguan (press 5 on the lift)
邮箱：394413500@qq.com
Tel: 13823605006