CN

13823605006

Product Centre

Wafer UV Stripping Machine 05

Product Overview

Product Specifications

1(1)(1).png

 

Product Information
Quality Assurance / Extended Warranty / Peace of Mind
Product specifications:
Frame sizes: 6, 8 and 12 inches Loading and unloading method: Manual handling.
Film type: UV film Product positioning: Positioning using locating pins
Wafer size: 12 inches and below Power supply: 220V, 350W, 8A
Light source: LED; UV cold light source with a wavelength of 365 nm Dimensions (W × D × H): 645 mm × 620 mm × 195 mm
Radiation intensity: 600–1000 mW/cm² Net weight: 40kg
Fixture placement: 6, 8 and 12 can be switched between Equipment specifications: PLC + touchscreen software control

 

Features of the multi-channel UV de-gelling machine:

1. Can accommodate wafer rings of various sizes simultaneously, including 6-inch, 8-inch, 12-inch and other custom sizes

2. Multi-channel design, allowing for simultaneous gel separation or separate, independent gel separation

3. Features for adjusting the illuminance and energy percentage for gel dissolution; the illuminance is adjustable.

4. Time adjustment

5. Completion notification for gel dissolution

6. The method of irradiation using ultraviolet light from bottom to top is still employed; the ultraviolet rays are directed straight onto the UV film, thereby preventing radiation damage to the wafer.

7. Closed-system gelation, which has no effect on human health

8. The UV light is in an LED package, so no preheating is required, saving time

9. Imported UV LED light source, with a service life of at least 20,000 hours

Other specifications:
Suitable sizes Dimensions Suitable for wafers Thickness (mm) Number Material
6 inches 211.5*211.5*1.5 150 mm (6 inches) 1.2~1.5 DSMTQB06 SUS420J2
8 inches 275.2*275.2*1.2 200 mm (8 inches) DSMTQE08
10 inches 324*324*1.5 250 mm (10 inches) DSMTQB08
12 inches 380*380*1.5 300 mm (12 inches) DSMTOAMO