Wafer UV Stripper 07

Quality Assurance / Extended Warranty / Peace of Mind

Product Specifications

Product features:

◆ Compact design, suitable for full-chip illumination of 6-, 8-, 10- and 12-inch chips

◆ Adjustable time and brightness

◆ Bottom-up illumination, making it easy to position wafers

◆LED cold light source, an environmentally friendly product characterised by low temperature, uniform exposure, a compact design and low energy consumption; it is a semiconductor...

◆ The ideal model for the sports industry, and low temperatures do not damage heat-sensitive materials

◆ The service life is more than 10 times longer than that of standard mercury lamps, with a continuous service life of 15,000–30,000 hours.

◆ Zero maintenance costs; no need to replace the light source components during long-term operation

◆ Enclosed light source design, with no UV leakage; harmless to humans and fast adhesive removal, taking just a few seconds

◆ Backwards compatibility with smaller sizes is supported

◆ With an automatic alarm function

◆ The slanted touchscreen display makes it easier to read data. During the production process, when using a conventional adhesive removal machine, the curing time for UV adhesives is generally 30–40 seconds, meaning the adhesive removal process takes a long time.

However, when using the new generation of Deshengxing LED UV adhesive removal machines, the chemical reaction between the adhesive properties of the film and the UV wavelength is accelerated, thereby reducing the curing time,

This system is therefore highly suitable, with a fast de-gelling rate, and can be used for both research and development and mass production;