200×200 mm UV adhesive remover

UV Adhesive Remover, 200×200 mm exposure area, LED-based cold-light UV adhesive remover, 365 nm, 395 nm
8-inch UV de-bonding machine De-bonding area: φ200 mm
Dongguan Jude Weiye Electronic Technology Co., Ltd. specialises in the manufacture of UV adhesive removal machines, which feature low heat output, excellent adhesive removal performance, high speed and are environmentally friendly.

This UV de-bonding machine is also fitted with positioning plates to prevent the object being de-bonded from shifting.

What is a UV adhesive remover? Various modelsUV De-gelling MachineView
UV debonding machines are known by many names: Semiconductor UV de-bonding machine UV film debonding machine UV de-bonding machine Semiconductor de-bonding machine UV film de-bonding machine Fully automatic de-bonding machine Wafer UV de-bonding machine UV film de-bonding Semiconductor tape de-bonding UV film de-bonding Semiconductor UV de-bonding machine   Semiconductor packaging de-bonding machine LED packaging de-bonding machine LED chip film removal machine Chip de-bonding machine Wafer de-bonding machine UV film removal machine UV film curing machine UV film removal machine Ultraviolet mask exposure machine UV tape for semiconductor processes UV tape exposure solutions UV Wa fer Tape Curing Systems UV release dicing tape for wafers UV-curable adhesive tape round wafers up to 8″
In the semiconductor chip manufacturing process, prior to die cutting, the wafer is secured to a frame using a die-cutting adhesive film. Once the die-cutting process is complete, the adhesive film is exposed to UV light to cure and harden it, thereby reducing its tackiness and ensuring the smooth progression of subsequent packaging operations. In other words, UV adhesive tape possesses very high adhesive strength, holding the wafer firmly in place during the wafer polishing or dicing processes. When exposed to ultraviolet light, this adhesive strength is reduced. Consequently, after UV exposure, the wafer or chip can be easily peeled away from the adhesive tape. UV de-bonding machines address the de-bonding process in wafer, glass and ceramic cutting operations. Their applications are currently not limited to the semiconductor packaging industry, but also extend to the removal of UV films from semiconductor materials used in optical lenses, LEDs, ICs, semiconductors, printed circuit boards and portable hard drives. Most UV de-bonding machines in existing technology utilise UV mercury lamps; however, mercury lamp light sources, which generate high levels of heat, are prone to damaging heat-sensitive materials. Furthermore, they are inefficient and make it difficult to accurately control quality standards, rendering them unsuitable for irradiating high-precision components such as chips. Shenzhen Deshengxing Electronics Co., Ltd. utilises an environmentally friendly, low-temperature LED UV light source for its de-bonding machines, which effortlessly completes the UV film de-bonding process without damaging the wafers, thereby fully meeting production requirements.

Application: Suitable for removing UV film and UV tape from semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, printed circuit boards and portable hard drives, as well as from glass filters. The UV de-bonding machine is a fully automated piece of equipment designed to reduce and remove the adhesive properties of UV film and cutting film tape. For components such as wafers and glass, this de-bonding device is used to remove UV tape affixed to 8-inch, 12-inch and 15-inch mounting fixtures. It offers highly efficient de-bonding capabilities, rapidly reducing the adhesion of the UV tape to the components.

Features of the UV de-gelling machine:
1) Compact in size, suitable for full-chip illumination of 6-, 8-, 10- and 12-inch chips
2) Adjustable time and brightness; touchscreen operation; simple and convenient
3) Illumination from below, making it easier to position the wafer
4) LED cold light source: an environmentally friendly product characterised by low temperature, uniform exposure, a compact design and low energy consumption; it is the ideal model for the semiconductor industry, and the low temperature causes no damage to heat-sensitive materials
5) It has a service life more than 10 times longer than that of a standard mercury lamp, with a continuous service life of 15,000–30,000 hours.
6) Zero maintenance costs; no need to replace the light source components during long-term operation
7) Enclosed light source design, with no UV leakage, and harmless to humans

To order customised UV adhesive removal machines in other models, please contact Dongguan Jude Weiye Electronic Technology Co., Ltd.: Mr Liu on 18928278160.