UV Debonding Machine for Semiconductor Chips; 5-inch UV Debonding Machine with Cold-Light LED

UV de-bonding machine; UV de-bonding machine for semiconductor chips; Cold-light source LED UV de-bonding machine; 5-inch UV de-bonding machine

During the production process, when using conventional de-gelling machines, the curing time for UV adhesives is generally 30–40 seconds, and the de-gelling process takes a long time.

However, when using the new-generation Deshengxing LED UV adhesive removal machine, the chemical reaction between the adhesive properties of the film and the UV wavelength is accelerated, thereby reducing the curing time. Consequently, this system is highly suitable, offering rapid adhesive removal, and can be used for both research and development and mass production.

Applications of the UV de-bonding machine: Suitable for the removal of UV coatings from semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, wafers, printed circuit boards and portable hard drives.

Parameters:

Host Parameters:

Dimensions of the fixture loading slide table:

(internal dimension)

If you don’t understand, just ask me.

Features:

1. Wafer sizes: Available in 4-inch, 5-inch, 6-inch, 8-inch and 12-inch; other sizes can be customised.

2. The operator simply needs to place or remove the workpiece; all other tasks are fully automated.

3. Compact design with easy-to-operate sliding drawer-style doors

4. To be used in conjunction with the jigs and fixtures required by the user

5. Irradiation method: from bottom to top

6. Utilising an imported LED UV light source, this model operates at low temperatures, is environmentally friendly, produces no noise or radiation, provides uniform exposure, features a compact design and has low energy consumption, making it the ideal choice for the semiconductor industry.