8-inch manual wafer laminating machine, 6-inch laminating machine, 12-inch semiconductor wafer laminating machine, wafer thinning and dicing

Dongguan Judeweiye Electronic Technology Co., Ltd.
Supplier of manual wafer laminating machines, 6-inch, 8-inch and 12-inch pick-and-place machines, wafer laminating machines, blue film laminating machines, and wafer thinning, dicing and laminating machines

 

The manual film application machine series comprises fast and efficient machines specifically designed for the cutting processes of wafers, glass, LEDs, PCBs and ceramics. The machine’s unique film-saving design significantly reduces film application costs. It is equipped with air-cushioned pressure rollers (with adjustable tension) and a flexible platen design, which not only accommodates products of varying thicknesses but also minimises film application stress, ensuring the products remain undamaged. It is easy to use and can be operated immediately without the need for training.

 

Key features:

1. Suitable for blue films, UV films, PET substrate films and double-layer films.

2. An optional micro-perforated film-application tray suitable for ultra-thin wafers.

3. The heated, elastic film-coating stage is designed to adapt to wafers of varying thicknesses.

4. A unique design featuring adjustable pressure on the film-application rollers.

5. Fitted with a circumferential cutter and a cross-cut blade.

6. Optional ionised air bar electrostatic removal device.

7. Compact in size, designed to sit on a desk.

 

Manual film applicator model DSXU-WAFER MOUNTER6 is suitable for wafers up to 6" in size DSXU-WAFER MOUNTER8 is suitable for wafers up to 8" in size DSXU-WAFER MOUNTER12 is suitable for wafers up to 12" in size

Hui Sheng Film Manual Film Application Machine:

The specially designed film-saving mechanism makes this series of manual film applicators highly economical, saving approximately 15% compared to standard manual film applicators, thereby significantly reducing customers’ film application costs; these cost savings will be even more pronounced when using expensive UV films, both now and in the future.

 

Micro-perforated film-application tray for ultra-thin wafers (optional):

The film-application stage, featuring a micro-perforated design combined with a unique air-flow system and elastic support structure, is suitable for wafers, glass or ceramics as thin as 100 µm; This structure, combined with a roller assembly featuring flexible, air-cushioned support and adjustable tension, minimises damage to ultra-thin wafers during film application, thereby significantly reducing the likelihood of breakage.

 

Anti-static Teflon-coated film application tray with heating function and elasticity:

The heated platen, with its adjustable temperature range, ensures that the film adhesion can be optimised to the ideal level.

The spring-loaded stage can adapt to wafers, glass or ceramics of varying thicknesses.

The anti-static Teflon coating on the surface not only minimises the static electricity generated during the application of the film, but also effectively prevents physical scratches to the chip.

 

This machine is equipped with an automatic film-retrieval system and is suitable for use with double-layer film featuring a protective layer.

For further details, please call:
Tel: 18928278160 Mr Liu (also on WeChat)

Manufacturer: Dongguan Jude Weiye Electronic Technology Co., Ltd.

Address: 3rd Floor, Building 5, No. 1 Fuda Road, Zhangyang, Zhangmutou, Dongguan, Guangdong Province