Wafer Stripping Machine

Our strengths

12 years’ experience in the industry, with over a thousand real-world case studies

1. Quick, bubble-free film removal;

2. The work surface is Teflon-coated to ensure that the wafer remains undamaged during the film-peeling process;

3. Heating range: ambient temperature to 120 degrees Celsius, adjustable; temperature control accuracy: ±2 degrees Celsius;

4. Ionising fan (ESD), to remove static electricity;

5. The electrical components are supplied by well-known brands such as SMC, Omron, Mitsubishi and Tianyi, or brands of equivalent quality;

Wafer Stripping Machine

A wafer stripper is a piece of equipment used in the wafer preparation process within the semiconductor industry. In semiconductor manufacturing, wafers are typically made of silicon or other materials,

They form the substrate for chip manufacturing. During the fabrication process, the wafer is usually coated with a protective film to shield its surface from contamination, damage or oxidation.

A wafer stripper is used to remove the protective film from the surface of a wafer.

Technical Specifications for Film Peeling Machines

Technical Specifications:

1) Suitable wafer sizes: 4”, 5”, 6”, 8” and 12”

2) Suitable wafer thickness: 100–800 µm

3) Wafer clamping method: vacuum suction

4) Workbench heating: 10–120 °C

5) Workbench material: aluminium with a Teflon non-stick coating.

6) Types of peel-off adhesive tape: blue film, UV film, etc.

7) Dimensions and weight:

Length 433 × Width 400 × Height 334 mm, 40 kg

8) Film removal speed: 50 seconds per sheet

9) Control panel: On/off button.

10) Operation: Manual loading and unloading; manual film removal (optional). Alarm notification upon completion of operation.

11) Electrostatic control: Keyence anti-static ionising fans, which control the electrostatic charge level to below 100 V inside the machine and during the film-peeling process

12) Compatibility: Supports the grinding and thinning of 6–12-inch wafers; multiple work surfaces can be used simultaneously

The film-peeling process usually involves the following steps:

1. Loading wafers: Wafer peelers usually have a loading area where the wafers to be processed are placed inside the machine.

Wafers can be loaded individually or processed in batches.

2. Aligning the wafers: Before the film is peeled off, the wafers must be correctly aligned to ensure that the film-peeling machine can process the surface of each wafer accurately.

3. Film removal: The wafer film removal machine uses appropriate tools, such as a scraper or film removal blade, to remove the protective film from the surface of the wafer.

Care must be taken when peeling off the film to avoid damaging the wafer surface.

4. Removal and disposal of membrane material: The membrane material that has been stripped off is collected for subsequent disposal or recycling.

5. Unloading the wafers: The processed wafers are unloaded from the film-stripping machine and prepared for the next stage of processing.

For details of the specific process, please contact our customer service team.

Wafer stripping machines are capable of efficiently removing the protective film from the surface of wafers, thereby ensuring their quality and reliability.

The film stripping process is one of the key steps in semiconductor fabrication and plays a crucial role in the success of subsequent process steps.