Imported blue film

Genuine imported Nitto Blue Film wafer tape SPV-224R for thinning, polishing and dicing, 280 mm wide

Nitto Blue FilmProduct description:

1. Blue protective tape is used in semiconductor wafer fabs or packaging plants during the back-side grinding, dicing and thinning processes.

Common sizes for LED die attachment are 180 mm × 100, 200 mm × 100, 230 mm × 100 and 280 mm × 100.

II. Purpose:

1. Semiconductor silicon wafers — blue film for cutting, UV film for cutting, protective film with release liner

2. Semiconductor silicon wafers — thinning, back-grinding

3. Semiconductor silicon wafers — film that can be torn by hand after thinning

4. Semiconductor silicon wafers — Flip-chip film

5. Semiconductor silicon wafers — thermal release film, UV film

6. Blue protective tape is used as surface protection tape during the back-side polishing process of silicon wafers in IC/semiconductor manufacturing.

A protective film for the circuit surface during the back-grinding of semiconductor silicon wafers (IC/semiconductor process).

A film used during the polishing of semiconductor silicon wafers.

Country of origin: Original manufacturing sites in the United States, Japan, Taiwan and elsewhere.