Acid-resistant UV viscosity-reducing agent

LED chips on ceramic wafer substratesUV viscosity-reducing filmPhotodegradable cutting protection film; acid-resistant PO film; acid- and alkali-resistant semiconductor cutting protection film

Product description:

The MC-UV3217 is a UV-curable tack-reducing film based on PO substrate, coated with an acid- and alkali-resistant acrylic adhesive.

Features/Applications:

1) This protective film is quite sticky before exposure to UV light; after UV exposure, its stickiness is significantly reduced and it can be easily peeled off;

2) Mainly used for cutting wafers and ceramics, and for thinning glass; utilises UV-curable adhesives.

3) For use in environments requiring resistance to acid and alkali corrosion, glass reinforcement, and the electroplating of metal fittings.

Shelf life: 6 months at room temperature (23°C) and a relative humidity of 55%.

Test environment: temperature 23°C ± 2, humidity 30–50%. As the adhesive is sensitive to cold in winter, it must be allowed to warm up for 4 hours before the steel plate is applied for testing,

to ensure accuracy;

Points to note:

1) If this material is stored for a prolonged period at temperatures above 60°C, its adhesive strength will decrease significantly.

2) The technical information above is for reference only and shall not be used for product acceptance purposes.

3) Store the product in a cool, well-ventilated place, away from direct sunlight.

4) When using the product in special circumstances, please test it first to ensure it is suitable.

The above figures represent average values obtained from laboratory tests and are not intended for standard use. Data may vary depending on the test method used; it is therefore recommended that you select a suitable product

Before purchasing, please try the product out and assess it for yourself.

UV tape is specifically designed for positioning and cutting in the manufacturing processes of surface-mount electronic components, SMT components, MLCC chip capacitors and chip inductors; surface processing of semiconductor wafers; component manufacturing and processing in the electronics and optoelectronics industries; thinning, grinding and polishing of LCD and TP touch panel glass; LED cutting, grinding and polishing; thinning and grinding processes for sapphire substrates; wafer grinding and cutting; and the handling and processing of various silicon wafers, packaging substrates, ceramics, glass and quartz for precision electronic components, as well as the machining and cutting of minute parts made from various materials. Coated with a special adhesive offering high adhesion, it securely holds the wafer in place during cutting with exceptional strength; even small wafers will not shift or peel away, ensuring they do not detach or scatter during the grinding and cutting processes, preventing chipping and expansion, and enabling precise cutting to guarantee processing quality. Once processing is complete, simply exposing the wafer to an appropriate amount of ultraviolet light instantly reduces the adhesive strength. Even large wafers can be picked up easily and accurately without leaving adhesive residue, causing delamination or contamination. This improves pick-up efficiency during wafer handling, eliminates contamination caused by adhesive residue, and ensures that the UV exposure does not adversely affect the ICs.

Features of UV tape:

*High adhesion during cutting; ensures that the wafer does not shatter, leaves no adhesive residue, prevents fragmentation, does not expand and prevents back-side failure during cutting, grinding and other machining operations.

*The rapid UV curing time ensures quality during the manufacturing process and effectively improves productivity.

*When the adhesive tape is peeled off, there are essentially no issues such as adhesive residue or tears, ensuring that subsequent processes can proceed smoothly.

*Anti-static (optional)

*Resistant to acids and alkalis

Points to note:

1) Before applying the tape, please wipe the surface of the substrate to remove any grease, dust, moisture, etc.

3) The adhesive strength of the tape will decrease rapidly when exposed to sunlight; therefore, when storing the tape, it must be placed in a light-proof bag and kept in a cool, shaded place.

3) When using the adhesive tape, please ensure that the ambient temperature is between 10℃ and 25℃. Use outside this temperature range may result in poor adhesion.

4) When using the tape, please do not touch the adhesive side directly with your hands.

5) If the sticker is applied in the wrong place, please use a brand-new piece of tape; do not reuse the tape.

6) When using this product for other new processes, please carry out tests before trialling it.

As there are numerous product specifications, this quotation is for reference only and is not a final offer. For further product specifications and detailed quotations, please contact us via Wangwang or by telephone. We are committed to providing you with the very best service!

 

UV-cured film

 

Base material: PO, PET

 

Colour: clear, milky white,

 

Total thickness: 0.06 mm–0.175 mm (can be customised to customer requirements)

 

Adhesive layer thickness: 0.01–0.025 mm

 

Adhesion to glass / 180-degree peel strength prior to UV curing: 600–1,600 grams (9.8 N/in)

 

Adhesion strength after glass lamination and UV curing / 180-degree peel strength after UV curing: 2–5 grammes (0.02 N/in)

 

Adhesive residue: None

 

Heat resistance: -10 °C for 2 hours / 80 °C for 2 hours

 

Operating temperature (°C): -10 to 80

 

Standard sizes (width in mm): 230 mm, 275 mm, 280 mm, 300 mm, 380 mm, 400 mm

 

Standard length: 100 metres

 

Features of UV protective film:

 

1. High adhesion during cutting; after UV curing, the adhesion is very low, so the wafers do not scatter when picked up and no adhesive residue remains.

 

2. The UV curing time is rapid, effectively improving work efficiency.

 

3. Maintain the integrity of the grains during cutting (with no grain loss whatsoever) and minimise chipping during the cutting process.

 

4. Ensure that the crystals do not shift or fall off during normal conveyance, and that no water seeps between the crystals and the tape.

 

5. It should have appropriate elasticity.

 

6. We can develop UV films using different manufacturing processes and supply products in special sizes to meet customer requirements.

 

8. Excellent cutting performance and load-bearing capacity.

 

9. Supports low-temperature back-side bonding of wafers

 

Suitable for cutting the following products:

 

LED chips on EMC or ceramic substrates, QFNs, PCBs, packaged semiconductor chips, PLC components, fibre-optic connector components, glass filters, etc.

Can be used as a substitute for imported products:

 

Nitto: NBD-5172K, NBD-5170K and other products

 

Shiliang: Products including 6360-00, 6360-15, 6360-50, 6360-95, etc.

 

Lintec: D-510T, D-210, C-204, C-206