The role of wafer coating machines in the semiconductor manufacturing process
What is a wafer film coater?
Wafer Coating MachineThis equipment is used after the cutting process to uniformly stretch the film, thereby separating the cut chips and spacing them evenly apart by a specified distance. It utilises a servo motor-driven film-stretching mechanism, and the stretching height and speed can be configured via the touchscreen. Wafer Coating MachineThere are several different names for it:Wafer expansion machines,LEDWafer expansion machines,LEDFilm expansion machine, grain expansion machine, wafer expansion machine, ring-type grain expansion machine, plastic ring film expansion machine, chip expansion machine, wafer expansion machine,6Inch-scale crystal growth machine,8Inch-scale crystal growth machine,10Inch-scale crystal growth machine,12Inch-sized wafer expansion machines, semi-automatic wafer expansion machines, manual wafer expansion machines.
Following the dicing process in the manufacture of semiconductor integrated circuit chips, the film attached to the back of the diced chips is secured using an expansion ring, and the film is caused to move towardsX-YThe direction expands uniformly, thereby enabling the chip to expand to any width, which greatly facilitates post-processing following the chip cutting/segmentation process.
Common applications of wafer expansion machines: Wafer expansion machines are also known as wafer stretcher or wafer expanders. They are widely used in light-emitting diodes, small- and medium-power transistors, backlights,LED, the grain expansion process in the manufacture of integrated circuits and certain specialised semiconductor devices. For example,LEDIn the industry, grain expansion film machines will closelyLEDThe chips are evenly spaced to facilitate their attachment to the workpiece. It utilisesLEDThe film’s heat-sealability is controlled by a dual-cylinder system operating from above and below, feeding a single sheetLEDThe film spreads evenly in all directions and automatically takes shape once a satisfactory gap between the films has been achieved; the film remains taut and does not deform. The ceramic tray features a constant-temperature design and is simple and intuitive to operate.
Following the dicing process, in which semiconductor integrated circuit chips are cut from a wafer, the gaps between the chips are very small, which can lead to the chips colliding with one another and causing chipped edges, resulting in waste.A film expansion machine can quickly and easily transfer the cut chips toX-YThe film is expanded in a controlled direction, with the spacing between chips uniformly increased to the required dimension, thereby separating the chips and preventing damage caused by collision, thus producing intact integrated circuit chips. The worktable is designed with a heated, temperature-adjustable surface, which enhances the film expansion effect and significantly increases the expansion height to meet the diverse needs of customers. The film expansion height is adjustable. The film protection speed is adjustable. The workbench temperature is adjustable.
Applications: Wafer coatingThe equipment is suitable forIC、Diode、Transistor、Glass、LED、QFN、PCBand other industries; it is suitable for the expansion or stretching processes that follow the dicing stage in the manufacture of semiconductor integrated circuit chips.Wafer expanderThis product range is specifically designed for wafers,The film expansion process following the cutting of LED chips and the like is equipped with imported guide rails and a temperature control system, enabling the spacing between the grains to be expanded uniformly.The following models of wafer coating machines are currently available:6-inch film expansion machines, 8-inch film expansion machines, 10-inch film expansion machines, 12-inch film expansion machines, semi-automatic wafer film expansion machines, manual film expansion machines; for custom sizes, please contact Mr Hu on 13823605006
