An Introduction to the Wafer Slicing Process
In the previous article, we gave a brief introduction toWafer Grinding and Thinning Process, Next, we will introduce the slicing process
Dicing: Dicing involves separating the large wafer that has been fabricated into individual chips, thereby dividing the chips that are joined together.
The wafer dicing process involves a wide range of equipment and instruments. Dongguan Jude Weiye Electronics Technology Co., Ltd. specialises in providing supporting equipment for wafer dicing in the semiconductor industry. Mass-production equipmentWafer De-bonding Machine Wafer Coating Machine Film-spreading machines and various other pieces of equipment and consumables. If you are unsure which specific model of equipment would be most suitable, please feel free to discuss this with us.
