Wafer Thinning Process
An Introduction to the Wafer Thinning and Polishing Process Flow
First, let us take a brief look at the process of IC production. It is divided into three stages: upstream design, midstream manufacturing, and downstream packaging. Upstream design comprises chip design and photomask fabrication. Midstream encompasses chip manufacturing, testing, and the thinning and dicing processes. Downstream consists of packaging and testing.
Definition of ‘Jianhua’
Thinning: As the name suggests, this is the process of reducing the thickness of a wafer using specific technical methods.
Dicing: Dicing involves separating the large wafer that has been fabricated into individual chips, thereby dividing the chips that are joined together.
Process for reducing the use of Chinese characters
Incoming wafers – application of die-cut film – back-side thinning and polishing – application of dicing film – joining of die-cut film – dicing – UV exposure to release the adhesive
Once the mould has been changed, the next step is die-cutting. Take a look at the second technical article in the Judewei News:An Introduction to the Wafer Slicing Process
The grinding and thinning process involves the use of a wide range of associated equipment. Dongguan Judeweiye Electronic Technology Co., Ltd. specialises in the research, development and manufacture of such equipment.Wafer Coating Machine，Wafer De-bonding Machine. We welcome discussion within the industry.
