News and Information

UV-curing LED chip packaging technology

17 September 2026

UVA LED packaging technology: UVA LEDs are generally used for curing applications. Let’s discuss this today.UVA LEDPackaging technology

As various types of UVA LED light sources differ in terms of wavelength, power and application, they consequently require different packaging methods.

For example: TO-type, Lumen-style, through-hole and SMD types… and many other LED packaging formats.

This section primarily covers SMD packaging types with a wide range of applications. Currently, common SMD packaging types can be broadly categorised into the five main categories shown in the figure below: PCT/MEC/SMC, inorganic packaging, …

Among these, UV LED products with a power rating of 1W or more primarily utilise ceramic packaging; the ceramic substrates used are generally classified into two main types: thin-film ceramic substrates and thick-film ceramic substrates.

At present, ceramic stents produced domestically are primarily manufactured using thin-film processes, whilst those produced overseas are mainly manufactured using thick-film processes.

Four common ceramic substrate packaging solutions.

Option 1: Ceramic with Moding encapsulation:

This type of packaging is commonly used for 1–3W devices; it is relatively low-cost and is generally employed in consumer products and applications where the device is illuminated for short periods; however, its stability is somewhat lacking.

Option 2: Ceramic and glass encapsulation:

Commonly found in packages containing more than 10,000 components, these offer moderate cost and good stability, and are generally used in UV curing applications; however, they are prone to moisture penetration due to adhesive ageing or poor sealing, which can lead to instability in the light source.

Generally, this can be effectively remedied by employing a secondary optical seal, which can further enhance performance.

Option 3: Thick-film packaging:

At present, this packaging format is mainly used in countries such as Japan and South Korea, and it requires a secondary optical design.

Option 4: Inorganic encapsulation:

No moisture or foreign particles can penetrate the light-emitting device, giving the product a clear advantage in terms of stability, making it suitable for use in industrial applications.

In the next article, Zixin will continue to share its optoelectronic technology solutions for UVA modules.

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News and Information

UV-curing LED chip packaging technology

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