Uses and Applications of Wafer Coating Machines
Wafer Coating MachinePurpose:
Following the dicing process, in which semiconductor integrated circuit chips are cut from a wafer, the gaps between the chips are very small, which can lead to the chips colliding with one another and causing chipped edges, resulting in waste.
The film expansion machine can quickly and easily expand cut chips in the X-Y directions, uniformly increasing the spacing between chips to the required dimensions, thereby separating them and preventing damage caused by collision, thus producing intact integrated circuit chips. The worktable is equipped with a heating system and features adjustable temperature settings, which enhance the spreading effect and significantly increase the spreading height to meet the diverse needs of customers. The spreading height is adjustable. The spreading speed is adjustable. The worktable temperature is adjustable.
Applications: Wafer expansion equipment is suitable for industries such as ICs, diodes, transistors, glass, LEDs, QFNs and PCBs, and is used for the expansion or stretching process following the dicing stage in the manufacture of semiconductor integrated circuit chips. The wafer expansion machine series is specifically designed for the post-cutting expansion process of wafers, LEDs and similar products. Equipped with imported guide rails and a temperature control system, it ensures uniform expansion of the spacing between grains. Current models of wafer expansion machines include: 6-inch expansion machines, 8-inch expansion machines, 10-inch film expansion machines, 12-inch film expansion machines, semi-automatic wafer film expansion machines and manual film expansion machines. For custom sizes, please contact Mr Hu on 13823605006.
