Functions of a Wafer Coating Machine
Following the dicing process in the manufacture of semiconductor integrated circuit chips, the film attached to the back of the diced/segmented chips is secured using an expansion ring. As the worktable rises, the film is uniformly expanded in the X-Y directions, thereby spreading the chips to any desired spacing, which greatly facilitates post-dicing/segmentation processing.
Common applications of wafer coating machines:Wafer Coating MachineAlso known as a wafer spreading machine or wafer spreader. It is widely used in the wafer spreading process for the production of light-emitting diodes, small- and medium-power transistors, backlight units, LEDs, integrated circuits and certain specialised semiconductor devices. In the LED industry, for example, the wafer expansion machine evenly separates closely packed LED wafers, enabling them to be mounted more effectively onto soldering substrates. It utilises the heat-induced plasticity of the LED film and employs dual-cylinder vertical control to evenly expand individual LED wafers in all directions; once a satisfactory wafer spacing is achieved, the machine automatically moulds the film, ensuring it remains taut and free from deformation. The ceramic tray features a constant-temperature design, and operation is simple and intuitive.
