How to manufacture a wafer film coating machine
Design Principles of a Wafer Film Expansion Machine: A wafer film expansion machine is a film expansion clamping device comprising an upper base, a lower base, an upper clamping plate and a lower clamping plate. Guide rods and drive rods are provided between the upper and lower bases; both ends of the guide rods are connected perpendicularly to the upper and lower bases respectively, the lower end of the drive rod is pivotally mounted within the lower base, whilst its upper end extends through the upper base and is rigidly connected to the output shaft of the drive motor via a coupling; The shaft of the drive rod is provided with a first lead screw section and a second lead screw section, each with opposite threads; the upper and lower clamping plates are each connected on their sides to a guide sleeve and a drive sleeve, respectively; the guide sleeve is fitted over the outer surface of the guide rod, whilst the drive sleeve is screwed onto the outer surface of either the first or second lead screw section; The upper and lower pressure plates are each fitted with a pressure frame; the difference in radius between the two pressure frames is utilised to clamp the blue film on the wafer. The structural design of this utility model is rational; it utilises the principle of lead screw transmission to drive the upper and lower pressure plates towards or away from each other, offering the advantages of speed and accuracy, thereby ensuring film-spreading efficiency.
Points to note when selecting a wafer film coater: Please provide the dimensions of the inner and outer rings of your wafer expansion ring, as well as the type of film you are using. Contact Shenzhen Deshengxing Electronics Co., Ltd. for bespoke orders: 13823605006, Mr Hu
‘Excerpt from the patent section’
