{"id":773,"date":"2026-06-29T15:43:43","date_gmt":"2026-06-29T15:43:43","guid":{"rendered":"https:\/\/uvstry.com\/?p=773"},"modified":"2026-06-29T15:43:43","modified_gmt":"2026-06-29T15:43:43","slug":"wafer%e7%a1%85%e7%89%87%e6%99%b6%e7%b2%92%e5%a6%82%e4%bd%95%e6%89%a9%e5%a4%a7%e9%97%b4%e8%b7%9d%ef%bc%9f%e4%b8%ba%e5%95%a5%e8%a6%81%e7%94%a8%e6%99%b6%e5%9c%86%e6%89%a9%e6%99%b6%e6%9c%ba%ef%bc%9f","status":"publish","type":"post","link":"https:\/\/uvstry.com\/en\/wafer%e7%a1%85%e7%89%87%e6%99%b6%e7%b2%92%e5%a6%82%e4%bd%95%e6%89%a9%e5%a4%a7%e9%97%b4%e8%b7%9d%ef%bc%9f%e4%b8%ba%e5%95%a5%e8%a6%81%e7%94%a8%e6%99%b6%e5%9c%86%e6%89%a9%e6%99%b6%e6%9c%ba%ef%bc%9f\/","title":{"rendered":"How can the spacing between die on a silicon wafer be increased? Why is a wafer die-spacing machine used?"},"content":{"rendered":"

You are welcome to come and test the system or arrange for it to be taken out of service. Please contact: Mr Liu on 18928278160<\/p>\n

I. The result is shown in the figure<\/p>\n

Before and after the die expansion process on silicon wafers, the uniformity and quality of the cutting lines are assessed to facilitate subsequent operations.<\/p>\n

\"35c9032abe08ee1676926ba8ed6de795.jpg\"<\/p>\n

Before wafer expansion<\/p>\n

\"ffdb11381184e32436e838ffddaa89f5.jpg\"<\/p>\n

After wafer expansion<\/p>\n

II. Why use a crystal-expanding machine?<\/p>\n

As the cutting grooves between the wafers are only so wide, when sorting a particular wafer, there is a risk of it coming into contact with the surrounding wafers. Therefore, by using a wafer expansion machine to expand the film, the subsequent processing stages can pick up the wafers more effectively, thereby preventing them from colliding with one another and protecting them.<\/p>\n

\"16038f884a6b7732dcc6906da507441.png\"<\/p>\n

Damaged products under a microscope<\/p>\n

After using the wafer-expansion machine,<\/p>\n

Increasing the spacing between particles prevents collisions from all sides and protects the grains.<\/p>\n

\"0759464cd08ea33f5c9d63a44dfc2298.jpg\"<\/p>\n

III. Adaptation to Subsequent Processes<\/p>\n

Die bonding machines, sorters, etc.<\/p>","protected":false},"excerpt":{"rendered":"

Before and after the die expansion process on silicon wafers, the uniformity and quality of the cutting lines are assessed to facilitate subsequent operations.<\/p>","protected":false},"author":1,"featured_media":774,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-773","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"\nwafer\u7845\u7247\u6676\u7c92\u5982\u4f55\u6269\u5927\u95f4\u8ddd\uff1f\u4e3a\u5565\u8981\u7528\u6676\u5706\u6269\u6676\u673a\uff1f - \u6df1\u5733\u5e02\u5fb7\u80dc\u5174\u7535\u5b50\u6709\u9650\u516c\u53f8-UV\u673a-UV\u89e3\u80f6\u673a|\u6676\u5706\u8d34\u819c\u673a|\u6676\u5706\u6269\u819c\u673a|\u6676\u5706\u6495\u819c\u673a|UVLED\u56fa\u5316\u673a<\/title>\n<meta name=\"robots\" content=\"noindex, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta 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