{"id":1326,"date":"2026-09-17T01:39:30","date_gmt":"2026-09-17T01:39:30","guid":{"rendered":"https:\/\/uvstry.com\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\/"},"modified":"2026-09-17T01:39:30","modified_gmt":"2026-09-17T01:39:30","slug":"%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba","status":"publish","type":"post","link":"https:\/\/uvstry.com\/en\/2026\/09\/17\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\/","title":{"rendered":"Wafer Thinning Process"},"content":{"rendered":"<p style=\"text-align: center\"><span style='color: #262626; font-family: \"Microsoft YaHei\" font-size: 26px; text-align: center; text-wrap: wrap'>Wafer Thinning Process<\/span><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">An Introduction to the Wafer Thinning and Polishing Process Flow<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">First, let us take a brief look at the process of IC production. It is divided into three stages: upstream design, midstream manufacturing, and downstream packaging. Upstream design comprises chip design and photomask fabrication. Midstream encompasses chip manufacturing, testing, and the thinning and dicing processes. Downstream consists of packaging and testing.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602858384255819776\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786750478554.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Definition of \u2018Jianhua\u2019<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Thinning: As the name suggests, this is the process of reducing the thickness of a wafer using specific technical methods.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Dicing: Dicing involves separating the large wafer that has been fabricated into individual chips, thereby dividing the chips that are joined together.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Process for reducing the use of Chinese characters<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Incoming wafers \u2013 application of die-cut film \u2013 back-side thinning and polishing \u2013 application of dicing film \u2013 joining of die-cut film \u2013 dicing \u2013 UV exposure to release the adhesive<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602861774604238848\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786751163319.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602864712118599680\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786751115856.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602864243887251456\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786751104320.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602865854089998336\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786752202101.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602865854130888704\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786752178547.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602865854173884416\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786753550989.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" data-catch-result=\"success\" id=\"1602865854081609728\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786753171777.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><img decoding=\"async\" data-catch-result=\"success\" id=\"1602865854147887104\" src=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786753205251.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Once the mould has been changed, the next step is die-cutting. Take a look at the second technical article in the Judewei News:<span style=\"box-sizing: border-box;text-decoration:underline\">An Introduction to the Wafer Slicing Process<\/span><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">The grinding and thinning process involves the use of a wide range of associated equipment. Dongguan Judeweiye Electronic Technology Co., Ltd. specialises in the research, development and manufacture of such equipment.<a href=\"https:\/\/www.uvstry.cn\/Products\/996747088068698112.html\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\"><span style=\"box-sizing: border-box; color: #9B59B6\">Wafer Coating Machine<\/span><\/a><span style=\"box-sizing: border-box; color: #9B59B6\">\uff0c<\/span><a href=\"https:\/\/www.uvstry.cn\/Products\/996747088018366464.html\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\"><span style=\"box-sizing: border-box; color: #9B59B6\">Wafer De-bonding Machine<\/span><\/a>. We welcome discussion within the industry.<\/p>\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Wafer Thinning Process: An Introduction to the Wafer Thinning and Polishing Process First, let us take a brief look at the process by which an IC is created. This is divided into three stages: upstream design, midstream manufacturing, and downstream packaging. Upstream design comprises chip design and photomask fabrication. The midstream stage comprises chip fabrication, testing and the thinning and dicing processes. The downstream stage consists of packaging and testing. Definition of \u2018thinning\u2019: As the name suggests, this is the process of reducing the thickness of a wafer through specific process methods. Dicing: Dicing involves separating the large, fabricated wafers into individual<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1,35],"tags":[],"class_list":["post-1326","post","type-post","status-publish","format-standard","hentry","category-news","category-news2"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.3 (Yoast SEO v28.1) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>\u6676\u5706\u51cf\u8584\u5de5\u827a - \u6df1\u5733\u5e02\u5fb7\u80dc\u5174\u7535\u5b50\u6709\u9650\u516c\u53f8-UV\u673a-UV\u89e3\u80f6\u673a|\u6676\u5706\u8d34\u819c\u673a|\u6676\u5706\u6269\u819c\u673a|\u6676\u5706\u6495\u819c\u673a|UVLED\u56fa\u5316\u673a<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/uvstry.com\/en\/2026\/09\/17\/\u6676\u5706\u51cf\u8584\u5de5\u827a\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"\u6676\u5706\u51cf\u8584\u5de5\u827a\" \/>\n<meta property=\"og:description\" content=\"\u6676\u5706\u51cf\u8584\u5de5\u827a\u6676\u5706\u51cf\u8584\u7814\u78e8\u5de5\u827a\u6d41\u7a0b\u7b80\u4ecb\u9996\u5148\u5148\u6765\u5927\u6982\u4e86\u89e3\u4e00\u4e0bIC\u8bde\u751f\u8fc7\u7a0b\u3002\u5206\u4e0a\u6e38\u7684\u8bbe\u8ba1\uff0c\u4e2d\u6e38\u7684\u5236\u9020\uff0c\u4e0b\u6e38\u5c01\u88c5\u4e09\u4e2a\u9636\u6bb5\u3002\u4e0a\u6e38\u8bbe\u8ba1\u5305\u542b\u82af\u7247\u8bbe\u8ba1\u548c\u5149\u7f69\u5236\u9020\u3002\u4e2d\u6e38\u5305\u542b\u82af\u7247\u5236\u9020\uff0c\u6d4b\u8bd5\u548c\u51cf\u8584\u5212\u7247\u6d41\u7a0b\u3002\u4e0b\u6e38\u662f\u5c01\u88c5\u548c\u6d4b\u8bd5\u3002\u51cf\u534e\u5b9a\u4e49\u51cf\u8584\uff1a\u987e\u540d\u601d\u4e49\u662f\u901a\u8fc7\u7279\u5b9a\u7684\u5de5\u827a\u65b9\u6cd5\u5c06\u6676\u5706\u7531\u539a\u53d8\u8584\u7684\u8fc7\u7a0b\u3002\u5212\u7247\uff1a\u5212\u7247\u662f\u5c06\u5df2\u6d41\u7247\u7684\u5927\u5706\u7247\u8fdb\u884c\u5206\u522b\" \/>\n<meta property=\"og:url\" content=\"https:\/\/uvstry.com\/en\/2026\/09\/17\/\u6676\u5706\u51cf\u8584\u5de5\u827a\/\" \/>\n<meta property=\"og:site_name\" content=\"\u6df1\u5733\u5e02\u5fb7\u80dc\u5174\u7535\u5b50\u6709\u9650\u516c\u53f8-UV\u673a-UV\u89e3\u80f6\u673a|\u6676\u5706\u8d34\u819c\u673a|\u6676\u5706\u6269\u819c\u673a|\u6676\u5706\u6495\u819c\u673a|UVLED\u56fa\u5316\u673a\" \/>\n<meta property=\"article:published_time\" content=\"2026-09-17T01:39:30+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/yt20260325.szsqsd.com\/static\/upload\/image\/20240712\/1720786750478554.png\" \/>\n<meta name=\"author\" content=\"zjs1197@qq.com\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"zjs1197@qq.com\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/\"},\"author\":{\"name\":\"zjs1197@qq.com\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/#\\\/schema\\\/person\\\/660dc527c8ce957b3a81f46b4b83b672\"},\"headline\":\"\u6676\u5706\u51cf\u8584\u5de5\u827a\",\"datePublished\":\"2026-09-17T01:39:30+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/\"},\"wordCount\":7,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/#primaryimage\"},\"thumbnailUrl\":\"http:\\\/\\\/yt20260325.szsqsd.com\\\/static\\\/upload\\\/image\\\/20240712\\\/1720786750478554.png\",\"articleSection\":[\"\u65b0\u95fb\u8d44\u8baf\",\"\u884c\u4e1a\u52a8\u6001\"],\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/\",\"url\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/%e6%99%b6%e5%9c%86%e5%87%8f%e8%96%84%e5%b7%a5%e8%89%ba\\\/\",\"name\":\"\u6676\u5706\u51cf\u8584\u5de5\u827a - 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