{"id":1314,"date":"2026-09-17T01:39:30","date_gmt":"2026-09-17T01:39:30","guid":{"rendered":"https:\/\/uvstry.com\/uvled%e5%b0%81%e8%a3%85%e5%88%b6%e7%a8%8b%e4%b9%8b%e5%9b%ba%e6%99%b6\/"},"modified":"2026-09-17T01:39:30","modified_gmt":"2026-09-17T01:39:30","slug":"uvled%e5%b0%81%e8%a3%85%e5%88%b6%e7%a8%8b%e4%b9%8b%e5%9b%ba%e6%99%b6","status":"publish","type":"post","link":"https:\/\/uvstry.com\/en\/2026\/09\/17\/uvled%e5%b0%81%e8%a3%85%e5%88%b6%e7%a8%8b%e4%b9%8b%e5%9b%ba%e6%99%b6\/","title":{"rendered":"Die Attachment in the UV LED Packaging Process"},"content":{"rendered":"<p><\/p>\n<p style=\"text-align: center\"><span style='color: #262626; font-family: \"Microsoft YaHei\" font-size: 26px; text-align: center; text-wrap: wrap'>Die Attachment in the UV LED Packaging Process<\/span><\/p>\n<section style=\"box-sizing: border-box; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><span style=\"box-sizing: border-box; font-weight: bolder\">UV LED Packaging Process \u2014 Die Attachment<\/span><\/section>\n<p><section style=\"box-sizing: border-box; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">\u00a0<\/section>\n<section style=\"box-sizing: border-box; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">Die Attachment: This process involves using die-attach adhesive (silver adhesive, insulating adhesive or inorganic adhesive) to bond the chip to the substrate, thereby securing the chip in place on the substrate. It serves to stabilise and protect the chip, facilitate heat dissipation and ensure electrical connectivity.<\/section>\n<section style=\"box-sizing: border-box; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><br style=\"box-sizing: border-box\"\/><img decoding=\"async\" id=\"1404\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/5c46a88e-5dec-45c3-ae12-503d9bbbf32d.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<ul class=\"list-paddingleft-2\" style=\"list-style-type: none\">\n<li>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">\u00a0<span style=\"box-sizing: border-box; font-weight: bolder\">Framework of the Production Process for a Die Attachment Station<\/span><\/p>\n<\/li>\n<\/ul>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">\u00a0<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">The production process for a UV LED die-attach station can be divided into three main stages: preparation of raw materials (die-attach adhesive, carriers, wafers), die-attach and curing.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1405\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/05a0db1c-e093-4df6-8094-6f0a87a181ec.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<section style=\"box-sizing: border-box\">\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">More specifically, the production process at a die-attach station can generally be further subdivided as follows:<span style=\"box-sizing: border-box; font-weight: bolder\">Equipment preparation, material preparation, wafer expansion process, dispensing process, die attachment process, baking process<\/span>etc.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">1. Equipment Preparation  Equipment Preparation:<span style=\"box-sizing: border-box;text-decoration:underline\"><span style=\"box-sizing: border-box; font-weight: bolder\"><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=34\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\">Wafer Enlarger<\/a><\/span><\/span>, die attach machines,<span style=\"box-sizing: border-box;text-decoration:underline\"><span style=\"box-sizing: border-box; font-weight: bolder\"><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=31\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\">Oven<\/a><\/span><\/span>\u00a0and other advanced intelligent automation equipment.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1407\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/1ed070e0-4e9b-4b82-938b-7c5bffbfa831.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">2. Preparation of materials<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1406\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/e541dc1e-0a17-4c89-8c11-94d38e784844.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">3. Crystal growth process; this process utilises\u00a0<span style=\"box-sizing: border-box;text-decoration:underline\"><span style=\"box-sizing: border-box; font-weight: bolder\"><a href=\"http:\/\/www.uvstry.cn\/product\/36\/\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\">Wafer Coating Machine<\/a><\/span><\/span><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1408\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/c7a2301e-e5ac-4815-b423-6a80848006f0.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">4. Dispensing process<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1409\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/23d3183d-5bbe-47d4-bf87-5373f7abeb8a.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">5. Die-attach process<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1410\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/a1e07818-19ec-4882-9706-0c63db9f98e1.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\">6. Baking process<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px\"><img decoding=\"async\" id=\"1411\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/9faf6e0e-77a2-4fe9-a279-ed21fe27d363.png\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<section style=\"box-sizing: border-box\">That concludes this instalment\u2019s introduction to the production process at the die-attach station in the UV LED packaging process. In the next instalment, we will be sharing details of the main LED packaging process: wire bonding.<\/section>\n<\/section>\n<\/section>\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Die Attachment in the UV LED Packaging Process \u2014 Die Attachment: This involves using die-attach adhesive (silver adhesive, insulating adhesive or inorganic adhesive) to bond the chip to the substrate, thereby securing the chip in place on the substrate. This serves to stabilise and protect the chip, facilitate heat dissipation and ensure electrical connectivity. Framework of the Production Process Flow for the Die Attachment Station in UV LED Packaging: The production process at the UV LED packaging die attachment station can be divided into three main stages: raw material preparation (die-attach adhesive, substrates, wafers),<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[34,1],"tags":[],"class_list":["post-1314","post","type-post","status-publish","format-standard","hentry","category-news1","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.3 (Yoast SEO v28.1) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>UVLED\u5c01\u88c5\u5236\u7a0b\u4e4b\u56fa\u6676 - 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