{"id":1311,"date":"2026-09-17T01:39:16","date_gmt":"2026-09-17T01:39:16","guid":{"rendered":"https:\/\/uvstry.com\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\/"},"modified":"2026-09-17T01:39:16","modified_gmt":"2026-09-17T01:39:16","slug":"disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab","status":"publish","type":"post","link":"https:\/\/uvstry.com\/en\/2026\/09\/17\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\/","title":{"rendered":"Differences in the DISCO TAIKO Manufacturing Process"},"content":{"rendered":"<p><\/p>\n<p style=\"text-align: center\"><span style='color: #262626; font-family: \"Microsoft YaHei\" font-size: 26px; text-align: center; text-wrap: wrap'>Differences in the DISCO TAIKO Manufacturing Process<\/span><\/p>\n<h1 id=\"conts_ttl\" style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 2.5rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\"><span style=\"font-size: 20px\">TAIKO Process<\/span><\/h1>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">The TAIKO process is a new technology for wafer back-grinding developed by DISCO. Unlike conventional back-grinding methods, this technology preserves the outer edge of the wafer (approximately 3 mm) whilst grinding only the inner circular area to achieve a thinner wafer. The introduction of this technology helps to reduce the risks associated with handling thin wafers and minimises warpage.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" id=\"1292\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/87a72729-992b-4108-8902-53d3d35b1522.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: auto; height: auto\"\/><\/p>\n<h2 style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 2rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\">\u201cThe advantages of the \u201dTAIKO process\u2019<\/h2>\n<h3 style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 1.75rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\">By leaving a border around the edge of the chip<\/h3>\n<ul class=\"list-paddingleft-2\" style=\"list-style-type: none\">\n<li>\n<p>Reducing chip warpage<\/p>\n<\/li>\n<li>\n<p>Improving the strength of the wafer<\/p>\n<\/li>\n<\/ul>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><span style=\"box-sizing: border-box; font-weight: bolder\">The chip is easier to use<br data-filtered=\"filtered\" style=\"box-sizing: border-box\"\/>The slimmed-down through-hole packaging makes it easier to process components such as terminal blocks<\/span><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" id=\"1293\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/4fdf821f-d956-4bbd-8128-d865d7619e0e.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<h3 style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 1.75rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\">The advantages of using a monolithic structure rather than similar constructions such as those with a rigid substrate<\/h3>\n<ul class=\"list-paddingleft-2\" style=\"list-style-type: none\">\n<li>\n<p>When high-temperature processes (such as metal plating) are required following the thinning of the wafer, no outgassing occurs.<\/p>\n<\/li>\n<li>\n<p>As it is a one-piece construction with a simple shape, this helps to minimise the ingress of particles.<\/p>\n<\/li>\n<\/ul>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" id=\"1295\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/e8d1e600-b4eb-4e8d-a119-0ec4f7ecf5a7.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<h3 style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 1.75rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\">The advantages of not applying load to the peripheral areas during grinding<\/h3>\n<ul class=\"list-paddingleft-2\" style=\"list-style-type: none\">\n<li>\n<p>It is more convenient to have stepped chips in the peripheral grinding area<\/p>\n<\/li>\n<li>\n<p>Zero corner collapse<\/p>\n<\/li>\n<\/ul>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" id=\"1296\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/01397f08-3a81-421e-9489-68c2e97f2652.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<h2 style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0.5rem; font-weight: 500; line-height: 1.2; font-size: 2rem; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; text-wrap: wrap\">TAIKO Process Flow Chart<\/h2>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><img decoding=\"async\" id=\"1297\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/a2a1055c-9ba4-4b58-9df9-42c7d3cc0fd5.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\">DSXUV specialises in the semiconductor wafer sector<span style=\"box-sizing: border-box;text-decoration:underline\"><span style=\"box-sizing: border-box; font-weight: bolder\"><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=2\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\">UV De-gelling Machine<\/a><\/span><\/span>\u3001<span style=\"box-sizing: border-box;text-decoration:underline\"><span style=\"box-sizing: border-box; font-weight: bolder\"><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=4\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\">Wafer Coating Machine<\/a><\/span><\/span>Research, development and manufacturing. We welcome technical discussions.<\/p>\n<p style=\"box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; color: rgb(102, 102, 102); font-family: \u5fae\u8f6f\u96c5\u9ed1; font-size: 16px; text-wrap: wrap\"><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=2\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\"><img decoding=\"async\" id=\"1063\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/4f87e05a-ad96-4135-b574-2e96e172e05f.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s\"\/><\/a><a href=\"https:\/\/uvstry.com\/en\/pro.php\/?lm=4\" style=\"box-sizing: border-box; color: rgb(112, 112, 112)\"><img decoding=\"async\" id=\"1059\" src=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/a6cf89de-5ee7-485e-97f7-86b498be4b98.jpg\" style=\"box-sizing: border-box; vertical-align: middle; border-style: none; filter: blur(0px); transition: all 0.3s ease 0s; width: 600px; height: 800px\"\/><\/a><\/p>\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>DISCO TAIKO Process: Distinct from the TAIKO Process. The TAIKO Process is a new technology for wafer back-grinding developed by DISCO. Unlike conventional back-grinding techniques, this technology preserves the outer edge of the wafer (approximately 3 mm) whilst grinding only the inner circular area to achieve thinning. The introduction of this technology helps to reduce the risk of damage during the handling of thin wafers and minimises warping. Advantages of the \u201cTAIKO process\u201d: By leaving a rim around the periphery of the wafer, the wafer<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[34,1],"tags":[],"class_list":["post-1311","post","type-post","status-publish","format-standard","hentry","category-news1","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.3 (Yoast SEO v28.1) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>DISCO TAIKO\u5de5\u827a\u533a\u522b - \u6df1\u5733\u5e02\u5fb7\u80dc\u5174\u7535\u5b50\u6709\u9650\u516c\u53f8-UV\u673a-UV\u89e3\u80f6\u673a|\u6676\u5706\u8d34\u819c\u673a|\u6676\u5706\u6269\u819c\u673a|\u6676\u5706\u6495\u819c\u673a|UVLED\u56fa\u5316\u673a<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/uvstry.com\/en\/2026\/09\/17\/disco-taiko\u5de5\u827a\u533a\u522b\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"DISCO TAIKO\u5de5\u827a\u533a\u522b\" \/>\n<meta property=\"og:description\" content=\"DISCO TAIKO\u5de5\u827a\u533a\u522bTAIKO\u5de5\u827aTAIKO\u5de5\u827a\uff0c\u662fDISCO\u516c\u53f8\u5f00\u53d1\u7684\u6676\u7247\u80cc\u9762\u7814\u524a\u7684\u65b0\u6280\u672f\u3002\u8fd9\u9879\u6280\u672f\u548c\u4ee5\u5f80\u7684\u80cc\u9762\u7814\u524a\u4e0d\u540c\uff0c\u5728\u5bf9\u6676\u7247\u8fdb\u884c\u7814\u524a\u65f6\uff0c\u5c06\u4fdd\u7559\u6676\u7247\u5916\u56f4\u7684\u8fb9\u7f18\u90e8\u5206\uff08\u7ea63mm\u5de6\u53f3\uff09\uff0c\u53ea\u5bf9\u5706\u5185\u8fdb\u884c\u7814\u524a\u8584\u578b\u5316\u3002\u901a\u8fc7\u5bfc\u5165\u8fd9\u9879\u6280\u672f\uff0c\u53ef\u5b9e\u73b0\u964d\u4f4e\u8584\u578b\u6676\u7247\u7684\u642c\u8fd0\u98ce\u9669\u548c\u51cf\u5c11\u7fd8\u66f2\u7684\u4f5c\u7528\u3002\u201cTAIKO\u5de5\u827a\u201d\u7684\u4f18\u70b9\u901a\u8fc7\u5728\u6676\u7247\u5916\u56f4\u7559\u8fb9\u51cf\u5c11\u6676\u7247\" \/>\n<meta property=\"og:url\" content=\"https:\/\/uvstry.com\/en\/2026\/09\/17\/disco-taiko\u5de5\u827a\u533a\u522b\/\" \/>\n<meta property=\"og:site_name\" content=\"\u6df1\u5733\u5e02\u5fb7\u80dc\u5174\u7535\u5b50\u6709\u9650\u516c\u53f8-UV\u673a-UV\u89e3\u80f6\u673a|\u6676\u5706\u8d34\u819c\u673a|\u6676\u5706\u6269\u819c\u673a|\u6676\u5706\u6495\u819c\u673a|UVLED\u56fa\u5316\u673a\" \/>\n<meta property=\"article:published_time\" content=\"2026-09-17T01:39:16+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/omo-oss-image.thefastimg.com\/portal-saas\/pg2024011708220329544\/cms\/image\/87a72729-992b-4108-8902-53d3d35b1522.jpg\" \/>\n<meta name=\"author\" content=\"zjs1197@qq.com\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"zjs1197@qq.com\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/\"},\"author\":{\"name\":\"zjs1197@qq.com\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/#\\\/schema\\\/person\\\/660dc527c8ce957b3a81f46b4b83b672\"},\"headline\":\"DISCO TAIKO\u5de5\u827a\u533a\u522b\",\"datePublished\":\"2026-09-17T01:39:16+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/\"},\"wordCount\":12,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/omo-oss-image.thefastimg.com\\\/portal-saas\\\/pg2024011708220329544\\\/cms\\\/image\\\/87a72729-992b-4108-8902-53d3d35b1522.jpg\",\"articleSection\":[\"\u6280\u672f\u5e38\u8bc6\",\"\u65b0\u95fb\u8d44\u8baf\"],\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/\",\"url\":\"https:\\\/\\\/uvstry.com\\\/2026\\\/09\\\/17\\\/disco-taiko%e5%b7%a5%e8%89%ba%e5%8c%ba%e5%88%ab\\\/\",\"name\":\"DISCO TAIKO\u5de5\u827a\u533a\u522b - 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